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25 May, 2015 - 14:49 By Kate Sweeney

UltraSoC and Teledyne LeCroy collaborate on debug and validation tech

Rupert Baines, CEO at UltraSoC

UltraSoC in Cambridge, UK is collaborating with California-based Teledyne LeCroy on debug and validation technologies.

The two companies aim to reduce time-to-market and overall development costs in a wide range of hi-tech industries, from automotive and computer peripheral manufacture, to emerging IoT applications.

Teledyne LeCroy, is a leader in protocol test solutions, delivering a range of hardware and software tools that enable engineers to verify, test, debug, and validate electronic system designs.

UltraSoC, which is based at St John’s Innovation Centre in Cambridge, provides silicon IP for data acquisition and analysis that can be “baked-in” to the complex semiconductor devices (System on Chip or SoC) at the heart of such designs. 

Joint work by the two companies will build on the capabilities of Teledyne LeCroy’s protocol analysis instruments, CrossSync and InSight tools, combining these with UltraSoC’s UltraDebug technology.

“Teledyne LeCroy is the leading name in protocol test; electronic design engineers around the world rely upon their solutions every day,” said Rupert Baines (pictured above), who became CEO at UltraSoC in April of this year, replacing Karl Heeks who now heads up Metrarc.  

Baines added: “We believe that the combination of UltraSoC and Teledyne LeCroy technology will put a powerful and unique capability in the hands of those engineers, not just making their job easier but also fostering innovation and problem-solving.”

Teledyne LeCroy’s ability to provide a high-level view of system behaviour and UltraSoC’s capabilities to offer visibility deep within the SoC creates a powerful toolset that allows an engineer to quickly and instinctively understand the system’s operation, spot problems and devise solutions.

The collaboration should benefit designers of a broad range of end-products. For example, hard disk manufacturers could combine protocol analysis of the external system-level interfaces, such as SATA, gathered via one or more Teledyne LeCroy instruments, with data gathered internally to the drive’s controller chip by UltraSoC’s UltraDebug technology. This capability will enable system developers to track information, including time sensitive events, as it flows from one side of an interface to another and correlate it with internal software execution.

Joe Mendolia, VP Marketing at Teledyne LeCroy, said: “Building dedicated debug and analytics IP into semiconductor devices dramatically eases the task of post-silicon validation and debug, one of the key bottlenecks in time-to-market today.  

“UltraSoC’s technology allows SoC designers to put together IP and processing cores from multiple vendors, with a unified on-chip analytics capability. Teledyne LeCroy’s key strengths are clearly complementary – in acquiring, displaying, and contextualising such data.”

The two companies will disclose further details of the collaboration at the upcoming 52nd Design Automation Conference (DAC) at San Francisco’s Moscone Center, June 7 – 11, 2015 on UltraSoC’s Booth (#3501).

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